SS-T12A for iPhone X Motherboard Stratified Heating Table 185 Degrees Accurate Rapid Separation Disassembly Platform
Description To remove the IP X motherboard layering we use the 185 degree layering process which comes from our fine analysis of IP X solder paste It also relies on the special heating design and precise temperature control ability of SS T12A Heat only the areas where the IP X motherboard needs to be removed to prevent improper heating The dual bayonet design ensures that the IP X motherboard is stable on the stage High purity copper is used as a negative film to ensure uniform and stable heat transfer and heating T12A AndroidT12A family adds Android motherboard heating system more powerful Suitable for most Android phone motherboard heating High purity copper as the negative film to ensure uniform and stable heat transfer and heating Special heating design and precise temperature control ability make maintenance more efficient and maintenance safer T12A FaceSunshine T12A adds ID heating station which is mainly used to repair ID cable and risk free replacement of distance sensor T12A X3We have always adhered to the design of high and low grooves which only heats the middle column and does not heat the CPU Accurately locate the parts that need to be heated1 Suitable for IP X XS XS MAX motherboard repair heating disassembly CPU and other components2 Silicone heat insulation high temperature resistance reduce the temperature of the bottom contact surface 3 High purity copper is used as a negative film to ensure uniform heat transfer and heat stability T12A N1