ESD PLA is an advanced ESD-safe connection designed for use in critical applications requiring ESD (ESD) protection. Manufactured using state-of-the-art multi-wall carbon nanotubes technology, state-of-the-art compounding technology and precision extrusion.Typical uses are:Semi-con: Hard disk components, enclosures, wafer handling, fixtures, enclosures and connectorsIndustrial: Devices, conveying, dosing, tools at the end of the arm and sensor applicationsTarget conductivity for 3DXSTAT ESD PLASpecification: 10 ^ 6 to 10 ^ 9 ohms surface resistance on a 3DP sample using the concentric ring method, target 10 ^ 7 ohmsNote: Internal studies have shown that elevated extruder temperatures can achieve higher conductivity. Similarly, lower extruder temperatures have led to lower conductivity. Each printer is set up differently and has different part geometry. Therefore, expect a certain test time to understand how this filament works in your specific printer/application.Surface conductivity depending on the extruder temperatureThe surface resistance of the printed ESD-safe part depends on the extruder temperature of the printer. For example, if your tests show that the part is too insulating, increasing the extruder temperature will result in improved conductivity. Therefore, the surface resistance can be selected by setting the extruder temperature upwards or downwards depending on the measured value you receive from your side.This text is machine translated.